Xiaomi has shared several important details about its new in-house processor, the Xring 03. The company has confirmed that the new chipset will power two of its upcoming premium devices—the Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max.

The Xiaomi 18 Fold is set to debut in China in September. It will be the company’s new book-style foldable smartphone and the first Xiaomi smartphone to feature the Xring 03 chipset. Alongside the foldable, Xiaomi will also launch the Xiaomi Pad 9 Pro Max, which will use the same processor. However, the company has not yet revealed the exact launch date for either device.

Xiaomi 18 Fold and Pad 9 Pro Max Set to Debut in September

In information shared on Weibo, Xiaomi confirmed that the Xiaomi 18 Fold will launch in China next month. It will be the first device from the company to feature the new Xring 03 SoC. The Xiaomi Pad 9 Pro Max will be launched alongside it and will also be powered by the same chipset.

Xiaomi has gradually started revealing the capabilities of the Xring 03. According to the company, the chipset is part of a three-chip system. Alongside the main Xring 03 SoC, it includes the Xring O100 AI Acceleration Chip and Xring D100 AI Chip. These additional chips are designed to further enhance the devices’ AI processing capabilities.

The company claims that the Xring 03 has achieved more than 5.22 million points on AnTuTu, highlighting its strong performance capabilities.

The Xring 03 is built using a 3nm manufacturing process and has a 133mm² chip area with approximately 24 billion transistors. It features a 10-core CPU configuration with six efficiency cores and four performance cores. The processor can reach a maximum clock speed of 4.35GHz.

In benchmark testing, the Xring 03 reportedly scored 3,945 points in single-core performance and 15,221 points in multi-core performance.

For graphics, the chipset comes with a 16-core G2 Ultra NX GPU. Xiaomi claims that the GPU can deliver up to an 85% improvement in peak performance and an 182% increase in ray-tracing performance. At the same time, it reportedly consumes 64% less power compared with the previous technology. The chipset will also support LPDDR6 RAM.

Strong Focus on AI Performance

Dedicated AI hardware is another major component of the Xring 03 platform. According to Xiaomi, its new NPU can deliver up to 200 TOPS of AI performance and 3.13 TFLOPS of computing power.

This could help Xiaomi’s upcoming devices deliver improved on-device AI processing, smarter features, and better performance for other AI-powered tasks.

With the Xiaomi 18 Fold and Pad 9 Pro Max scheduled to launch in September, Xiaomi appears to be positioning the Xring 03 as a key chipset for its next generation of flagship devices. The exact launch date and pricing have not yet been announced, but Xiaomi is expected to reveal more details about both devices as their official launch approaches.